• 上葡京赌场
澳门葡京集团网址
  • 商品名称: BGA solder ball
  • 英文名称: BGA solder ball
  • 4546.com 207
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        BGA solder ball suitable for BGA, MCM, CSP and other advanced IC packaging and sophisticated packaging and micro-welding applications.
       BGA solder ball Common Specifications: 0.15,0.20,0.25,0.30,0.35,0.40,0.50,0.55,0.60,0.65,0.76 (Unit: mm) and the like. We can also provide help BGA solder paste.

 

4546.com

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